- The Dresden-based startup Commsolid develops very cost-effective and efficient radio chip solutions for IoT
- The Chinese Goodix Group is an integrated chip design and software solution provider dedicated to deliver leading biometrics and human-interface solutions for smart mobile terminals
- Together the companies want to develop new IoT communication solutions
- Goodix invests in Dresden location; new jobs to be created
- The High-Tech Gründerfonds has accompanied the startup from the very beginning until the successful exit
High-Tech Gründerfonds (HTGF) has successfully completed the sale of its shares in Commsolid GmbH, Dresden. Founded in 2015, the startup offers communication solutions for the LTE-based Narrow Band IoT standard. Sensors and small devices can be connected wirelessly and very cost effective to the Internet, even in remote areas without an external power supply. The buyer is Goodix Technology (HK) Company Limited, a subsidiary of the listed company Shenzhen Goodix Technology Co. Ltd. (SH: 603160), and one of the market leaders for biometric and human-interface technologies for mobile terminals. The combination of Commsolid’s energy-efficient communication solutions and Goodix’s RF chip expertise will jointly drive the development of SoCs (Systems on Chips) for IoT applications. With these SoCs many new applications are possible in areas such as healthcare, intelligent home technology, transportation, logistics systems, as well as in industry and agriculture.
“It is a win-win situation. Each of the two companies contributes its outstanding technology expertise to jointly offer innovative solutions to the IoT market faster,” emphasizes Lucille Bonnet, Investment Manager at HTGF. “I am personally very pleased with the excellent development that Commsolid has made in such a short time”.
Commsolid was founded in 2015 by former employees of Intel. The vision of the founders was to deliver intelligent IoT communication solutions. The merger brings the Dresden-based company a step closer to their dream. “Together we can now create highly optimized, connected sensor solutions that are needed in the future market of the IoT,” explains Dr. Matthias Weiss, Managing Director of Commsolid. Lars Melzer, the second Managing Director, adds: “NB-IoT is also the first step in the 5G mobile.”
Goodix values research and development “Made in Germany”. “Germany becomes our second R&D location outside of Asia. We will invest in Dresden, new jobs shall be created there”, David Zhang, CEO at Goodix Technologies underlines the importance of Commsolid for its group. Goodix currently maintains a design and development center for RF chips in California, USA.
In addition to HTGF, the sellers are the founders and personal shareholders of Commsolid GmbH, Mittelständische Beteiligungsgesellschaft Sachsen (MBS) and Startbahn Management GmbH (SMG).
About High-Tech Gründerfonds
High-Tech Gründerfonds (HTGF) is a seed investor that finances high-potential, tech-driven startups. With EUR 892.5 million in total investment volume across three funds and an international network of partners, HTGF has already helped forge 500 startups since 2005. Driven by their expertise, entrepreneurial spirit and passion, its team of experienced investment managers and startup experts help guide the development of young companies. HTGF’s focus is on high-tech startups in a range of sectors, including software, hardware and life sciences / chemistry.
To date, external investors have injected over EUR 1.9 billion into the HTGF portfolio via about 1,400 follow-on financing rounds. HTGF has also successfully sold interests more than 100 companies. Investors in this public-private partnership include the Federal Ministry For Economic Affairs and Energy, the KfW Banking Group, and Fraunhofer-Gesellschaft e.V., as well as the companies ALTANA, BASF, BAYER, B.Braun, Boehringer Ingelheim, Robert Bosch, BÜFA, CEWE, Deutsche Post DHL, Dräger, Drillisch AG, EVONIK, EWE AG, Haniel, Hettich, Knauf, Körber, LANXESS, media + more venture Beteiligungs GmbH & Co. KG, PHOENIX CONTACT, Postbank, QIAGEN, RWE Generation SE, SAP, Schufa, Schwarz Gruppe, STIHL, Thüga, Vector Informatik, WACKER and Wilh. Werhahn KG.
High-Tech Gründerfonds Management GmbH
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About Commsolid GmbH
Commsolid is the cellular IP Company providing leading edge ultra-low power solutions for the growing IoT market. This market demands highly optimized and easy to integrate communication solutions for the Narrowband-IoT standard, allowing every sensor to be directly connected to the Internet. Once integrated into customer integrated circuits (ICs), Commsolid’s baseband Intellectual Property (IP) enables smart applications that modernize and enrich our life in areas like health care, smart home, transport, logistic systems, or industrial applications. Leveraging the experience of more than a decade at the forefront of the wireless communication business, Commsolid’s owns unique capabilities to handle high volume and extremely integrated low power solutions. www.commsolid.com
Am Waldschloesschen 1
Goodix Technology (SH: 603160) is an integrated chip design & software solution provider dedicated to deliver leading biometrics and human-interface solutions for smart mobile terminals. As the world’s No.1 fingerprint solution provider for Android phones, its products and solutions bring unique value and are widely commercialized by global mobile brands including Amazon, Samsung, Huawei, OPPO, vivo, Xiaomi, OnePlus, Dell, Nokia, LG, ASUS, etc. Goodix today continues to build on its success by expanding and refining revolutionary solutions for smart terminals, IoT, and automotive applications, and enriching end-users’ experience worldwide. For more information, please visit: www.goodix.com
Address 1: Floor 2&13, Phase B, Tengfei Industrial Building, Futian Freetrade Zone, Shenzhen
Tel: +86-755-33338828 Zip code: 518052